Application in Semiconductor Production
Rotary Bond Tool (RBT)
Few other application fields require such precision or individual system solutions like the semiconductor branch. Alphasem AG is one of the world’s leading manufacturers of Die Attach Systems, which are used to attach semiconductor dies - tiny little electronic control modules - to their protective packages. Therefore the minute chips, which often are no larger than 0.15 x 0.15 mm, must be orientated and positioned with high accuracy.
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Alphasem AG www.alphasem.com
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| Easyline 8032 | Bond Tool in Use | Philip Howis, Technical Product Manager at Alphasem AG |
Rotary Bond Tool (RBT) |
Alphasem has now introduced the "Easyline 8032" machine featuring a new sub-assembly. The so-called "Rotary Bond Tool" provides both fast movements (90° in ca. 175 ms) and excellent placement accuracy (better than 0.02°) to position the tiny chips in any angular position”, explains Philip Howis, Technical Product Manager at Alphasem AG.
At the heart of the RBT is a Micro Harmonic Drive® gearbox in a customised design. The gear is driven by means of a stepping motor. The motor is mounted in parallel to the gear to allow a hollow shaft to be passed through the gear. The hollow shaft is used for an optical sensor which looks through the gear in order to make sure that the chip has been gripped successfully.
The output shaft is supported by pre-loaded ball bearings to provide the accuracy and axial stiffness required for the assembly.
